Introducing our no-clean solder paste—a product designed for optimal performance in both hand and machine printing applications. Experience excellent printing results with good stripping capabilities, ensuring a continuous issuance of stable performance without any bridging phenomena.
Benefit from the solder paste’s good wetting properties, effectively addressing issues like tombstone weld and other undesirable occurrences. This product boasts a wide technology and humidity curve, reducing dependence on specific curves. After welding, expect minimal tin beads and rare corrosion residue.
Achieve a high-tin-point gloss, coupled with exceptional strength and good electrical conductivity. The reflow preheating time can be remarkably short, making it especially suitable for flexible circuit applications.
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