Suitable for mobile phones, PC boards and other precision electronic chip level when welding. 1, the welding effect is very good. 2, no corrosive to IC and PCB. 3, the boiling point is only slightly higher than the melting point of solder.
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Ideal for soldering applications in mobile phones, PC boards, and other precision electronic chip levels. This soldering paste offers the following features:
1. Exceptionally good welding effects.
2. Non-corrosive to IC and PCB.
3. Boiling point is only slightly higher than the melting point of solder.
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