Soldering Paste RELIFE RL-421-OR (10 ml)

10CC RL-421-OR Strong activity BGA Flux Paste for PCB, SMD, BGA Reballing Soldering, Relife RL-421-OR Soldering Paste Flux can be used for soldering and reballing of computer and phone chips. It is a mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue. Help to repair the circuit boards and protect the electronic components. A necessary material for repairing the mobile phone mainboard

Features:

• Imported rosin, no virtual welding, easy to tin.
• The color is pure, with no impurities.
• Running in is fast and has less smoke.
• High insulation resistance, suitable for mobile phone PCB, and CPU repair.

Specifications:

• Type: Liquid
• Color: Light Yellow
• Bond Time: 2min
• Dry Time: 1min
• Volume: 10CC
• Item model number: ‎RL-421-OR

Applications:

• PCB Repair Tool
• BGA SMD
• High-precision circuit board SMT welding
• Chips Computers
• Smartphones
• BGA welding process etc.