FLUX PASTE RL-420S-UV

FLUX PASTE RL-420S-UV comes with configured needles and a needle plus push rod for enhanced ease of use. The tin application process is swift with minimal smoke. It is a no-clean formula, making it easy to tin with no residue left behind. This flux paste is specifically designed for mobile phone PCB, BGA, and PGA repair, offering versatility in applications.

Configured needles and the additional needle plus push rod make it particularly user-friendly. The flux is well-suited for various tasks such as sensor, wire, SMT repair, circuit welding, tablet phone, computer repair, home appliance repair, and more. Its fast-running tin process minimizes smoke production. The active ingredients enhance fluidity, making the tinning process even easier.