WL hard drive dedicated high temperature lead-free environmental solder paste

Product Specification

Product Description:

Introducing our Sn99Ag0.3Cu0.7 High-Temperature SMT Lead-Free Solder Paste, utilizing an alloy composition of 99% tin, 0.3% lead, and 0.7% copper. With a melting point of 227 degrees Celsius, this product is tailored for the demanding reflow soldering process. The preheat temperature ranges from 130 to 170 degrees Celsius, and the reflow temperature varies from 280 to 200 degrees Celsius.

Moreover, our solder paste features a flux with a highly reliable low-ion type halogen activator, ensuring exceptional reliability even without cleaning post-reflow soldering. This no-clean type lead-free solder cream is suitable for electronic PCB and SMT applications, eliminating the need for additional chemical cleaning agents. Its automatic spreading on the circuit board provides convenience and environmental protection.

Chemical Composition:

Applications:

Our Sn99Ag0.3Cu0.7 High-Temperature SMT Lead-Free Solder Paste is ideal for use in precise computer motherboards, phone motherboards, printed circuit boards (PCB), and various high-precision electronic circuit boards. It is dedicated to LED, SMT, electronic mount technology, and plug-in components.

Packing:

Available in bottle and syringe packing types, each bottle contains 500g of solder cream, while each syringe holds 100g. The packaging includes an inner layer of a bubble box and an outer layer of a carton for secure transportation.

Carton Dimensions: 34.527.523.5cm (lengthwidthheight), with a gross weight of 10kg. The minimum order quantity (MOQ) is 50kg.