MTECH NC-559-ASM Solder Flux 100% Original BGA PCB No-Clean 10cc Welding Paste

AMTECH NC-559-ASM Solder Paste has garnered widespread recognition from customers over the years due to its outstanding welding performance, transparent residue, and minimal smoke emission, making it a preferred choice in various maintenance applications. The following features highlight the excellence of NC-559-ASM Solder Paste:

1. **Outstanding Solder-Stickiness:**
The solder paste demonstrates exceptional solder-stickiness, ensuring reliable adhesion during the welding process.

2. **Excellent Anti-Wet Capacity:**
With excellent anti-wet capacity, this solder paste effectively repels moisture, contributing to the overall durability of soldered joints.

3. **Versatility in Package Types:**
Widely applicable to BGA, PGA, CSP packages, and Flip Chip operations, offering versatility in various soldering scenarios.

4. **Suitability for Multiple PCB Reflow:**
Ideal for multiple PCB reflow processes, ensuring compatibility with diverse manufacturing requirements.

5. **Environmentally Friendly:**
No-clean and lead-free formulation for environmental protection, aligning with modern sustainability standards.

6. **Versatility in Value Ball Applications:**
Suitable for various applications, including value ball operations in North-South bridge configurations, mobile phone chips, and CPU socket value balls.

7. **Cleaning Requirement for Large-Area Hand-Painted Value Balls:**
For large-area hand-painted value balls (referring to chips), a cleaning process is recommended to maintain optimal performance.

8. **Usage for Lattice Value Balls:**
Specifically designed for lattice value balls, such as those found on computer motherboard CPU sockets.

9. **Transparent Residue with Bright Solder Balls:**
The residue after soldering is transparent, ensuring bright solder balls without the inclusion of halogen substances (F/Cl/Br/I).

10. **Moderate Viscosity and Fine Particle Size:**
The paste exhibits a moderate viscosity and fine particle size (generally 2-5 µm), making it suitable for hand brushes, machine automatic printing, and other processes.

11. **Applicability to Reflow and Manual Value Ball Processes:**
The solder paste can be applied to both reflow soldering and manual value ball processes, offering flexibility in manufacturing workflows.

12. **Clear and Highly Clean:**
The paste provides a clear and very clean result, contributing to the overall quality and aesthetics of soldered components.