1. High resistance, robust vitality, and strong welding capability.
2. Outstanding welding performance with even and delicate tin beads, ensuring firm soldering joints.
3. Utilizes a new silver-containing formula with higher specifications, addressing common challenges in mobile phone repair.
4. Increased silver particles significantly enhance conductivity while rejecting virtual soldering.
5. Fine and sticky consistency, devoid of tin bubbling, ensuring uniform solder balls and robust soldering connections.
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