Liquid MECHANIC SOLDRING PASTE UV559 100g, For Soldering, 100 gm

Packaging Size
100 gm
Usage/Application
For Soldering
Brand
Mechanic
Physical State
Liquid
Dimensions
8cm x 7cm x 7cm

Liquid MECHANIC SOLDRING PASTE UV559 100g, For Soldering, 100 gm

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Description

**Product Specification:**

– **Packaging Size:** 100 gm
– **Usage/Application:** For Soldering
– **Brand:** Mechanic
– **Physical State:** Liquid
– **Dimensions:** 8cm x 7cm x 7cm
– **Minimum Order Quantity:** 10 Pieces

**Product Description:**

Introducing MECHANIC FLUX UV559 100G, a lead-free, environmentally friendly soldering solution. This flux paste is easy to tin, leaves no residue, and exhibits a commendable insulation effect.

**Definition:**
In the welding process, FLUX UV 559 plays a crucial role by removing oxides and reducing the surface tension of the materials to be welded, thereby offering two main effects through its chemical composition.

MECHANIC has innovatively developed two applications for phone PCB, BGA, and PGA SMD rework assistance paste. It operates in a low ionic activator system, ensuring a swift tin application, minimal smoke residue post-curing, and exceptionally high surface insulation resistance values. This makes it ideal for use in mobile phones and other communication products, minimizing electrical interference.

**Performance:**

1. *Residue Characteristics:* UV 559, as a leave-in help paste, features a very light residue color and offers a remarkably high Surface Insulation Resistance (SIR) value. It is particularly recommended for BGA, CSP, and ball array solder joint repairs.

**Package Content:**
1 x UV 559 Flux Paste (100 Gram)

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