– Zero-halogen, lead-free solder paste specifically developed for chip repair and soldering.
– Wide application, suitable for nano-chip, mobile phone PCB, electronic components, SMT repair, and BGA chip planting ball welding.
– Utilizes high barrier material to prevent layering and oil leakage.
– Made of imported special materials, undergoes repeated grinding and refining.
– No-clean formula with strong diffusion and wettability.
– Efficient rework solution for chip welding issues such as black screen crashes, unstable performance, automatic restarts due to false welding, and false welding.
– Smoke-free, residue-free, non-corrosive, high activity, and produces full and bright solder joints.
– Packaging upgrade with high barrier material to prevent stratification and oil leakage.
– New formula using imported special materials for lead-free environmental protection.
– No cleaning required, anti-oxidation, excellent wettability, and leaves no residue.
– Strong diffusibility, high activity, and produces minimal smoke.
– Easy to use with no waste.
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