iRepair MS1 Preheater X-14PM

Product Specification
Usage/Application: Motherboard
Primary Exchanger Material: Metal
Cooler Material: AIR COOLED
Flow Rate: HIGH
Model Name/Number: iRepair MS1
Product Description:

The iRepair MS1 Soldering Heating Station is designed for efficiently disassembling motherboards of iPhone models X, Xs, Xsmax, 11Pro Max, 12mini, 13mini, 12 Pro, and 13Pro Max. This versatile tool boasts compatibility with a wide range of iPhone models, including X, 11, 12, and 13 series.

Features:
– Mijing iRepair MS1 Multi-function Desoldering Station
– Upgraded heating element for fast and precise temperature control
– Countdown function for enhanced safety during layering and fitting processes
– First to support layering for iPhone 13 series models
– Compatibility with iPhone X/XS/XSMAX/11/11PRO/11PROMAX/12/12mini/12pro/12promax/13/13MINI/13PRO/13PROMAX, supporting A15 CPU chip, A15 HHD, iPhone 13 Baseband, iPhone 13 baseband, and glue removal
– Precise positioning, rapid temperature rise, non-slip weight increase
– Digital display temperature, intelligent 15-minute sleep function
– 183° three minutes extreme speed rise for efficient disassembly
– Safe disassembly with no damage to the motherboard

Supported Models:
– iPhone X/Xs/Xsmax/11/11Pro/11Promax/12mini/12/12Pro/12Promax/13mini/13/13Pro/13Promax

Brand: Mijing iRepair
Name: iRepair MS1 Multifunctional Desoldering Station
Packing Size: 220*158*50 (mm)
MS1 Upgrade Expansion Module
Packing Size: 114*79*10 (mm)