HST 868BGA-A Soldering Flux

*Mechanic® UV50 Soldering Flux Paste – HST 868BGA-A Soldering Flux

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Description

**Mechanic® UV50 Soldering Flux Paste – 40g**

Mechanic UV50 Soldering Flux Paste is characterized by its stable performance, low volatility, extended use cycles, and the absence of toxic or irritant smells. It stands out as the ideal auxiliary product for the repair and manufacturing of high-quality electronic products.

**Key Features:**

– **Oxide Removal in Soldering:**
This flux paste is designed to effectively remove oxides from the contacts of parts being soldered together, ensuring a clean and reliable solder joint.

– **Prevents Oxidation:**
Acts as a preventive measure against oxidation during soldering, contributing to the longevity of electronic components.

– **Eliminates Impurities:**
Ensures a pure and uncontaminated soldering process by eliminating impurities from the soldering surface.

– **Non-Corrosive:**
The flux is non-corrosive, safeguarding sensitive electronic components from damage during soldering.

– **Non-Conductive:**
Maintains non-conductive properties, ensuring the integrity of electrical circuits.

– **Advanced Quality:**
Crafted with advanced quality standards, providing reliability in electronic assembly and repair.

– **No Deterioration:**
Exhibits resistance to deterioration, maintaining consistent performance over time.

– **No Dry:**
Retains its optimal consistency, eliminating the risk of drying out during use.

– **Good Immersion:**
Facilitates good immersion for effective application and coverage.

**Specifications:**

– **Model:** UV50
– **Color:** Yellow
– **pH:** Mild
– **Weight:** 40g
– **Country of Origin:** China
– **Brand:** Mechanic

**Applications:**

– Ideal for use in electronic labs, professional service centers, and related industries (Electrical and Electronic).
– Suitable for PCB repair, soldering, ICs, mobile phone repair work.
– Effective for rework and repair of various electronic assemblies and components.
– Designed for SMT component pasting, including BGA and flip chip applications.
– Applicable to welding of preformed solder lugs.
– Suitable for any other soldering process that requires flux, including BGA ball planting.

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