Introducing the Amtech NC-559-ASM No Clean Lead Clean Solder Flux Solder Paste, featuring a 100g volume per bottle. This product, branded as Aemtech, is designed for various applications, including rework, sphere or pin attachment to BGA, PGA, and CSP packages, as well as assembly operations like flip chip attachment to PWB substrates. It serves as an essential and helpful tool in BGA reballing processes.
Key Features:
– Excellent solder-stickiness capacity
– Outstanding anti-wet capacity
– Widely applicable for BGA, PGA, CSP packages, and flip chip operations
– Suitable for multiple PCB reflow processes
– No-clean and lead-free for environmental protection
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