– Utilizes high-quality and high-purity tin ingot raw material through a fusion electrolysis unique refining process, ensuring good conductivity and thermal conductivity.
– Leaves minimal residue after welding, boasting a transparent appearance, high insulation resistance, and no corrosion of PCB, meeting no-clean requirements.
– A mid-temperature solder paste that effectively safeguards electronic components from damage caused by high temperatures, with fewer residues from rosin.
Tips for Using Low-Temperature Lead-Free Solder Paste:
– Store the solder paste in a 5-10 degree environment, with a shelf life of approximately 6 months.
– Operate in an environment with a temperature range of 20-25 degrees and humidity between 35-65%; the melting point is about 183°.
– Before using the solder paste, allow it to rest outside the refrigerator for at least 4 hours, letting it return to the working temperature. This prevents moisture from condensing on the paste’s surface, reducing the formation of solder balls.
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