RELIFE RL-423-UV Liquid Soldering Flux 10 ml Drip Type

Relief RL-423-UV Lead-Free No-Clean Flux, designed specifically for phone repair and BGA reball chip welding, is a special solder paste with transparent residue and a low solder ball rate. It exhibits excellent wetting ability on PCBs. The Lead-Free Solder Paste adheres to high-quality standards, aligning with IPC and JIS standards and fully complying with RoHS directives.

Our solder pastes feature an environmentally friendly flux and low oxidation spherical powder, characterized by extended, continuous repeatability printing time, high print definition, outstanding solderability, and the creation of bright, smooth solder joints. Special formulation designs ensure excellent rheology and high viscosity retention even after extended open time. The wide reflow process window minimizes transition concerns from tin-lead to lead-free solder paste.

With nearly transparent and non-corrosive residue, our pastes guarantee high surface insulation resistance and provide optimal results for in-circuit pin tests. Suitable for phone repair, PC BGA, electronics welding, and soldering applications, the main ingredients include imported rosin, high component thixotropic agent, antioxidant, stroma, and surfactants.

This drip-type antioxidant lead-free disposable flux belongs to the high-component flux category and is designed as a syringe viscidity flux for soldering, compatible with welding and rework stations. It significantly improves welding efficiency. Non-corrosive, non-conductive, and transparent, this viscidity flux prevents cross-flow on the PCB with its controlled liquidity.