1. Specifically designed for BGA IC applications.

2. Crafted from the latest rosin and other high-quality imported materials.

3. Key ingredients include imported rosin, high-component thixotropic agent, antioxidant, stroma, and surfactants.

4. Non-corrosive, non-conductive, and transparent.

5. Exhibits viscosity flux with low liquidity, preventing cross-flow on the PCB.

6. No irritant smell, excellent infiltration ability, persistent utility, and leaves no residue.

**Description: Sunshine RMA-228 Flux Paste**

Sunshine RMA-228 Flux Paste is a premium soldering flux meticulously designed to enhance soldering performance, promoting improved wetting and solder flow.

– Utilizes imported lead-free materials, boasting a perfect formula and high quality.
– Crafted from the latest rosin and other top-tier imported materials.
– Features a fast application with low smoke, minimal residue, and surfaces with low insulation resistance.

Widely employed in various electronic applications, including mobile phones, computers, graphics cards, projectors, and other electronic products. Ideal for welding and reworking BGA, CSP, and BGA chips, especially suitable for high-class mobile phones due to its exceptional tin running and soldering capabilities.